Additive Manufacturing for RF and Sensing Systems
Our group pioneers novel additive manufacturing (AM) techniques — including Laser-Enhanced Direct Print (LE-DPAM) and aerosol jet printing — to fabricate high-frequency electronics, 3D hybrid IC packaging, and structurally embedded RF systems. Applications span mm-wave phased arrays, advanced packaging for GaAs/MEMS oscillators, and Physically Unclonable Functions (PUFs) for hardware security.