• Principal Investigator; Funding Agency: L3Harris and Florida High Tech Corridor (FHTC); Co-Design and Additive Manufacturing of a 5G Phase Array Fed Lens Antenna;
  Project Period: 12/15/2023–12/31/2025.
• Principal Investigator; Funding Agency: NSF Future of Semiconductors (FuSe); Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS);
  Project Period: 9/01/2023–8/31/2026.
• Co-PI (PI: Ramesh Ayyala); Funding Agency: Department of Defense (HT9425-23-1-0502); Artificial Cornea and Sensor-Based Continuous IOP Monitoring System to Treat Patients with Cornea Blindness Secondary to War-Related Ocular Injuries;
  Project Period: 9/01/2023–8/31/2026.
• Principal Investigator; Funding Agency: ARL; PRANCE: 3D Integrated Antenna Arrays for High Precision Timing Estimation and Localization in GPS-Denied Jammed and Congested Spectral Environments;
  Project Period: 2/1/2024–1/31/2027.
• Co-PI (PI: G. Mumcu); Funding Agency: PRANCE; Additively Manufactured Multidimensional Cryptographic Physically Unclonable Functions for Wireless System Security;
  Project Period: 2/1/2024–1/31/2027.
• Co-PI (PI: G. Mumcu); Funding Agency: ARL; PRANCE: 3D Integrated Mm-Wave Reconfigurable Metasurfaces Using Laser-Enhanced Direct Print Additive Manufacturing (LE-DPAM);
  Project Period: 2/1/2024–1/31/2027.
• Principal Investigator; USF/IAE sub-award; Funding Agency: US SOCOM STTR Program; STTR Phase II - Collaborative Sensing and Identification using Autonomous Underwater Vehicles (AUVs) in a Mesh Network;
  Project Period: 10/15/2023–12/31/2025 (with additional FHTC match grant).
• Principal Investigator; Funding Agency: ARL (W911NF2020228); Laser-Enhanced Direct Print Additive Manufacturing (LE-DPAM) Enabled 3D Hybrid IC Electronics Packaging for High Performance and Low-Cost Active Phased Antenna Arrays;
  Project Period: 9/15/2020–12/31/2025.